New thermal and rheological approaches of chickpea–wheat dough for breadmaking

Chickpea (Cicer arietinum L.) is a legume of Fabaceae family whose grains are rich in proteins, total dietary fiber, unsaturated lipids, minerals and bioactive compounds with antioxidant activity. Therefore, chickpea flour can be an attractive high nutritional complement to wheat for the formulation composite breads. In present study, thermal rheological characteristics chickpea–wheat dough obtained by replacement 100 200 g/Kg were assessed Differential Scanning Calorimetry (DSC), Rapid Visco Analysis (RVA), Dynamic Mechanical Thermal (DMA) Texture Profile (TPA). Higher gelatinization temperatures coincidence higher pasting lower breakdown setback pastes mixtures. Furthermore, viscoelasticity changed presence flour, leading dynamic moduli (E’, E’’) values tangent phase angle (tan δ = E’’/E’) suggesting formation more elastic matrix. At deformations (TPA), hardness elasticity observed. These changes associated marked disruption gluten network certain components like different microscopic techniques.